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KEATIN® lead-free

KEATIN® SAC305 advanced Badlot

KEATIN® SAC305 advanced Badlot
KEATIN® SAC305 advanced Badlot
  • High yield
  • Fast wetting improves solderability, performs better than all Sn/Cu alloys
  • Excellent flow behavior, minimized bridge formation
  • Low dross formation reduces maintenance and solder consumption
  • High mechanical reliability of the connection
  • Low maintenance

  • Other alloys (SAC387 / SAC405), as well as solid wire available on request

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Details
Articlenumber Designation Type Weight PU Amount
600-40403-68 KEATIN® SAC305 advanced Badlot Sn96.5Ag3Cu0.5 0.2 kg triangular bars 20 kg
600-47002-68 KEATIN® SAC305 advanced Badlot Sn96.5Ag3Cu0.5 1 kg ingot 20 kg
600-40405-68 KEATIN® SAC300 advanced refill solder Sn97Ag3 0.2 kg triangular bars 20 kg
600-46011-68 KEATIN® SAC300 advanced refill solder Sn97Ag3 1 kg ingot 20 kg
600-47011-68 KEATIN® SAC300 advanced refill solder Sn97Ag3 3.5 kg bar with eyelet