KEATIN® SAC305 advanced Lotpaste KPF 06 AL0

• ISO 9454 1.1.3.C / IEC 61190-1-1 ROL0
• KPF 06 AL0 was specially developed to meet the requirements of demanding printing processes
• Provides best reliability and stability due to optimized composition of flux, alloy, grain size and metal content
• Very stable solder paste activity, thus has very good solder profile tolerance and excellent wetting properties
• Excellent melting results over a wide temperature range
• Melting range: 217-219 °C

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